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Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs
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3D Integration | SpringerLink
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Sombrero fedora de fieltro en naranja · M by Flechet · El Corte Inglés
Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits
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3D Integration | SpringerLink
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